TY - GEN
T1 - Towards a legged chip
AU - Datta, Timir
AU - Abshire, Pamela
AU - Turner, John A.
PY - 2011
Y1 - 2011
N2 - We describe a substrate for a Legged Chip, a CMOS integrated circuit with built in actuation mechanisms for motion. We have designed and fabricated a custom integrated circuit using a commercial 0.5m CMOS technology which implements walking gait control. The circuit specifications and physical implementation have been designed to take into consideration the addition of thermal actuators through low-temperature MEMS surface processing on fabricated CMOS dies. External connections will be limited to two leads for providing power and ground. This work represents progress towards a fully autonomous mobile integrated circuit.
AB - We describe a substrate for a Legged Chip, a CMOS integrated circuit with built in actuation mechanisms for motion. We have designed and fabricated a custom integrated circuit using a commercial 0.5m CMOS technology which implements walking gait control. The circuit specifications and physical implementation have been designed to take into consideration the addition of thermal actuators through low-temperature MEMS surface processing on fabricated CMOS dies. External connections will be limited to two leads for providing power and ground. This work represents progress towards a fully autonomous mobile integrated circuit.
UR - https://www.scopus.com/pages/publications/79960851452
U2 - 10.1109/ISCAS.2011.5938112
DO - 10.1109/ISCAS.2011.5938112
M3 - Conference contribution
AN - SCOPUS:79960851452
SN - 9781424494736
T3 - Proceedings - IEEE International Symposium on Circuits and Systems
SP - 2501
EP - 2504
BT - 2011 IEEE International Symposium of Circuits and Systems, ISCAS 2011
T2 - 2011 IEEE International Symposium of Circuits and Systems, ISCAS 2011
Y2 - 15 May 2011 through 18 May 2011
ER -