Towards an integrated approach for analysis and design of wafer slicing by a wire saw

A preliminary analysis is carried out using a standard finite element method to develop a better understanding of the process and determine possible ways of improvements in process design. The results of vibration (modal) and thermal stress analyses show that an accurate prediction of the effects of process parameters would help in improving the wire saw design. Similarly, a proper feed-back control algorithm would enable a better control of the process by using on-line information on wire tension and stiffness, temperature and other relevant quantities. A methodology for systematic approach to analysis and design of an advanced wire saw process is also outlined.