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Ultra-low load multiple indentation response of materials: In purview of wiresaw slicing and other free abrasive machining (FAM) processes

  • Stony Brook University

Research output: Contribution to journalArticlepeer-review

31 Scopus citations

Abstract

Effect of multiple simultaneous indentations on material's response is studied in purview of wiresaw slicing and other free abrasive machining (FAM) processes using finite element method. In the previous studies of FAM, especially the rolling-indenting process pertaining to wiresaw, single-abrasive indentation model has been employed. In this paper, we extend the study and modeling to multiple indenters in order to study the interaction between the indenters. It is shown in this paper that for silicon as the spacing between the abrasives decreases, the load required to achieve a prescribed depth of indentation decreases. Simulations are carried out for a perfectly sharp tip and an indenter with a tip radius of 2 μ m. Impact of multiple simultaneous indentation on the profile of indentation and mean contact pressure is also presented. Influence of the proposed model of multiple simultaneous indentations on the material's response and thus, the FAM processes, is primarily governed by two factors: the load acting on the indenters, and the spacing between the indenters.

Original languageEnglish
Pages (from-to)666-672
Number of pages7
JournalInternational Journal of Machine Tools and Manufacture
Volume47
Issue number3-4
DOIs
StatePublished - Mar 2007

Keywords

  • Multiple indentations
  • Nano-indentation
  • Silicon wafer
  • Wafer manufacturing
  • Wiresaw

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